Board Level Cyclic Bend Test

Toptester introduces a new ISO/IEC 17025 accredited test method: JESD22-B113B – Board Level Cyclic Bend Test. This method is “intended to evaluate and compare the performance of SMT ICs in an accelerated test environment for handheld electronic products applications.”.

During the test, PCBs are cyclically bended and the daisy chains of the components under test are monitored simultaneously. Strain gages are used to compare the in-situ strain and strain rate at the board level.